AMS Technologies’ liquid to air thermal management assemblies like our range of recirculating chillers, OEM liquid cooling kits, ambient cooling systems, liquid-based cabinet coolers and pump stations are the ideal solution when water or water-glycol mixtures are used to cool laser systems or reagents and drugs in analytical and life science applications or to remove heat from power electronics.
Featuring precise temperature control, quiet operation and high reliability, AMS Technologies’ portfolio of recirculating chillers ranges from compact thermoelectric chillers with a cooling capacity of 160 W to a multitude of stand-alone and rack-mount devices based on thermoelectric or compressor engines.
Our ambient liquid cooling systems are very energy-efficient systems for removing heat. Unlike compressor- or thermoelectric-based cooling systems there is only a pump and fans that need to be powered. These systems are the ideal solution whenever ambient temperatures are low or the heat source accepts temperatures above ambient such as CPUs or power electronics.
Other liquid to air thermal management assemblies offered by AMS Technologies include flush-mount liquid-based cabinet coolers or a liquid cooling development platform based on inverter controlled compressor technology, available in different performance levels up to 1600 W as a base for customized liquid-to-air cooling solutions. This development platform comprises of the refrigeration loop where customers connect their own liquid circuit to the evaporator – usually a brazed plate heat exchanger. Further features include compactness, low voltage DC supply, extremely low noise and vibration and/or environmentally friendly refrigerants .
Pump stations are used together with air blast coolers – finned tube heat exchangers – to remove heat from power semiconductors. Main features are utmost reliability due to the unique bullet proof, leak tight manifold block, temperature control via 3-way-valve, short commissioning time, automatic de-aeration and optionally redundant pumps, leakage monitoring or PLC control.
If you can’t find an off-the-shelf product that meets your needs for heat removal, get in touch with the AMS Technologies thermal management experts – together with our suppliers we can design and realize a customized liquid to air thermal management solution that is tailored to your requirements.
Our liquid to liquid thermal management assemblies like water cooling pump stations, LCS water cooling systems or turbo compressor recirculating chillers provide ideal cooling solutions for even higher thermal loads like large power electronics or energy storage systems.
One major application of our liquid-based cooling assemblies is transfer of heat using liquid-cooled cold plates . AMS Technologies’ broad range of cold plate technologies covers even the most specific fluid compatibility and performance requirements.
For lower thermal loads, AMS Technologies’ liquid-less air-to-air thermal management assemblies are the ideal solution to remove heat from cabinets, enclosures, consoles and battery packs or to cool reagents and drugs in analytical and life science applications.
Liquid to air thermal management assemblies use liquids such as water or water-glycol mixtures for the efficient removal of heat from components and systems such as lasers, power electronics or reagents and drugs in life science applications.
In a liquid-to-air thermal management assembly, this heat load is dissipated to the ambient air, usually via a high-performance liquid-to-air heat exchanger. Active cooling systems work with techniques such as compressors or thermoelectric modules (Peltier) and thus enable liquid temperatures below the temperature of the ambient air.
The cooling liquid circuit in the customer’s system, to which liquid to air thermal management assemblies are connected via hoses or pipes, absorbs heat loss directly where it is generated – usually by means of liquid-based cold plates. Liquid to air management assemblies are therefore suitable for applications with medium to high heat loads.
In comparison, air-to-air thermal management assemblies dissipate the heat of an air volume within an enclosure or cabinet to the outside environment, so the heat sources located in this enclosed air volume can only be cooled indirectly via the surrounding air. This kind of thermal management assemblies thus is more suitable for low to medium heat loads.
Alternative Terms: Liquid Cooling; Recirculating Chillers; Liquid-based Chillers; Ambient Liquid Cooling Systems; Liquid-based Cabinet Coolers