A plate which the customer’s device is mounted to and which is cooled or heated to a possibly moving set temperature within a certain range, with a certain temperature stability and a certain maximum heat load, would be the general description for our direct cooling solutions.
With the mDC-T-130-24-KIT, AMS Technologies offers a specific mini thermoelectric direct cooling evaluation kit, which is suitable to tune the wavelength of laser diode modules of approx. up to 100 W. This thermoelectric (Peltier) based kit provides 130 W cooling capacity and precise temperature control, also for various other applications like power electronics or life science.
With no liquids nor moving parts (except for the fans), this mini direct cooling system dissipates heat directly to the ambient air. The system’s Peltier modules can be configured for supply voltages of 12 or 24 VDC. Depending on the cooling requirements, the 60 x 60 mm fans’ speed can be reduced for quiet operation. The heat of the device to be cooled is removed directly by thermal conduction, without liquid or air as a heat transfer medium.
In addition to the mDC-T-130-24-KIT, AMS Technologies has developed several solutions with thermoelectric modules (TECs) and/or compressors. Some of our compressor-based solutions have been developed for portable, battery-powered applications for cooling laser diode heat loads of up to 1 kW.
Complementing our direct cooling solutions, AMS Technologies’ solution portfolio also includes air cooling solutions, comprising of compressor-based and Peltier-based air-to-air thermal management assemblies with cooling capacities of 400 W and 460 W respectively, as well as liquid cooling solutions like mini recirculating chillers for various heat loads or mini liquid cooling development kits.
AMS Technologies provides a broad range of air cooling components like fans, filter fans, heat sinks or thermoelectric modules (TECs), liquid cooling components like cold plates or heat exchangers, as well as thermal management accessories like thermal paste.
Alternative Terms: Plate to Air Thermal Management Solution