X-Scan Imaging’s XB series are single-chip, buttable silicon CMOS line scan detector boards with on-chip, fully integrated signal processing circuits designed for visible wavelength and x-ray imaging applications.
A scintillator layer is attached to the surface of the photodiode detector array, which converts X-ray photons into visible light. A variety of standard x-ray sensitive scintillator materials are available for applications in industrial inspection, airport security and cargo screening.
Each XB series detector board is configured as a contiguous linear array of photodiodes including a timing generator, digital scanning shift register, an array of charge integrating amplifiers, sample-and-hold circuits and signal amplification chain.
XB series detector boards are designed to permit end-to-end butting on a printed circuit board to form a single longer detector array for extended length scanning applications.
Element Pitch (Resolution) 0.05 to 1.6 mm
Pixel Size: 40 x 75 µm to 1.565 x 2.4 mm
Active Area Length: 51.2 to 307.2 mm
Number of Elements: 32 to 6,144
5 V Power Supply Operation
Simultaneous Integration by Using an Array of Charge Integrating Amplifiers
Sequential Readout With a Digital Scanning Shift Register
Maximum Data Rate: 1 MHz
Integrated CDS Circuits Allow Low Noise and Wide Dynamic Range up to >4000
User-specified Scintillator Material: GOS:Tb, CsI:Tl, CdWO4, etc.