SNx Series High-performance Sealed Microchip DPSS Lasers

SNx Series SNx High-performance Sealed Microchip DPSS Lasers Teem Photonics

AMS item number: SW11703

266, 355, 532, 1064 nm; Output Energy >0.2->18µJ; Repetition Rate >5->130 kHz; Output Power... more

Product information "SNx Series High-performance Sealed Microchip DPSS Lasers"

266, 355, 532, 1064 nm; Output Energy >0.2->18µJ; Repetition Rate >5->130 kHz; Output Power >2->300 mW; Peak Power >0.35->13 kW

For generating high peak power UV, green or IR pulses of a few hundred picoseconds, Teem Photonics’ SNx Series of high-performance sealed microchip lasers are economical, compact, and reliable. SNx Series lasers are designed for high average power, delivering multi kW peak power at repetition rates up to 130 kHz.

The SNP models’ sub-nanosecond 1064 nm pulses are directly generated from the diode-pumped, passively Q-switched Nd:YAG microchip engine with high average power, either from pulse energies of 20 µJ at 1064nm, or from repetition rates up to 130 kHz. The SNG models’ 532nm pulses as well as the SNV and SNU models’ micro joule UV pulses are produced by harmonic conversion from the passively Q -switched Nd:YAG engine IR system.

The SNx Series high-performance sealed microchip DPSS lasers are easy to operate and service. Controllers can be used with every laser head model and swapped within minutes while conserving constant performances.

Key Features:

Repetition Rate: >5 to ≤130 kHz
Wavelengths: 266, 355, 532, 1064 nm
Ultra-short Pulses: <0.55 to >3ns
Multi-kW Peak Power: >0.35 to >13 kW
Excellent Beam Quality: Beam Profile Gaussian TEM00, M²<1.2 to <1.4
Efficient, Air-cooled
Sealed Package, Extremely Long Life
Output Energy: >0.2 to >18 µJ
Average Output Power >2 to >300 mW

Applications: Material Processing; Cost-effective Marking Solutions; Graphitization; Instrumentation; Ranging; Differential Absorption LIDAR; Supercontinuum Generation; Distributed Temperature Sensing; Raman Spectroscopy; Biophotonics; Nanosurgery; Protein Cross-linking; Semiconductor Inspection; PCB Repair; Laser-induced Fluorescence (LIF); Micro Dissection; Organic Compound Marking and Micromachining; Biohazard Detection; Time Resolved Fluorescence; Laser-induced Breakdown Spectroscopy (LIBS); Photoacoustic Microscopy; Photoacoustic Imaging