515-1040 nm; Pulse Energy >40->600 µJ; Repetition Rate 0.1-30 MHz; Pulse Width <400 fs; Average Output Power >8->140 W
MKS Spectra-Physics’ Spirit® family sets new standards for femtosecond lasers in high-precision industrial manufacturing for micromachining of a broad variety of materials. These high-power femtosecond lasers deliver high average power(>140 W), high pulse energy (>600 µJ) and high repetition rates (up to 30 MHz) for increased throughput.
Customers benefit from the shortest industrially available pulse duration and superior beam quality that in turn enables machining complex and challenging parts with highest precision and quality with literally no heat affected zone (HAZ) at the highest throughput.
Spirit lasers are designed and tested to rigorous quality standards to offer reliable and robust 24/7 operation with lowest cost of ownership. The Spirit lasers also provide unprecedented performance for pumping of non-linear OPAs for 3-photon microscopy and spectroscopy applications. The user-configurable burst mode enables processing with increased ablation efficiency and thus increased throughput and quality for certain materials.
Pulse energy and repetition rate adjustability make the Spirit 1030-140 the ideal source for ablation and cutting. The integrated pulse picker offers full control of the laser output with single pulse selection and fast power control via an analog input signal.
Spirit 515-50 offers an output power of >50 W and a typical pulse width of <300 fs at a wavelength of 515 nm. At this shorter wavelength, machining of the finest features is possible, depending on the material, at equal or even higher speeds compared to those obtained with other technologies.
The Spirit series’ built-in data logging and analysis capability allows monitoring of all relevant laser parameters over the lifetime of the system. As such, this represents an indispensable diagnostics tool for service and preventive maintenance which significantly enhances uptime and thus productivity of the tool.
High Average Output Power: >8 to >140 W
High Pulse Energy: >40 to >600 µJ
Pulse Width: <400 fs
Adjustable Repetition Rate From Single Shot up to 30 MHz for Processing at Highest Throughput
User-configurable Burst Mode for Processing With Highest Ablation Efficiency
Wavelength Range: 515 to 1040 nm
Power Stability: <1% rms Over 100 h
Beam Diameter: 2.0, 2.5 mm
Beam Divergence, Full Angle: <0.5, <1 mrad
Laser Head Cooling Requirements: Water Cooled
Dimensions: 665 x 310 x 133 to 1003 x 369 x 205 mm
Applications: OLED Display Manufacturing; Semiconductor Wafer Dicing; Polymer Cutting; Metal Drilling and Cutting; Precision Machining of Hard and Brittle Materials; Polycrystalline Diamond (PCD) Cutting and Ablation; Sapphire Cutting and Drilling; 3-photon Microscopy; Optical Parametric Amplifier Pumping