Circular and Oval Configurations; Inner Ø 279 to 4,400 µm; Outer Ø 762 to 5,400 µm; Thickness 203 to 760 µm; Sealing Temperature +340 to +440 °C
OZ Optics’ GSP series of glass solder preforms is designed specifically for hermetic sealing of optical fibers in optoelectronic and all optical packaging. The glass solder preforms bond directly to glass and metal surfaces. This enables hermetic sealing of optical fibers to metal packages without costly metallization, thus reducing the cost and lead time of the whole packaging process.
After processing, assemblies sealed with glass solder can easily meet the stringent humidity resistance, hermeticity, and strength demanded for component packaging. Custom configurations can be designed for specific applications, please contact AMS Technologies to select a design to fit your needs.
GSP series glass solder preforms are compatible with single mode (SM), multi mode (MM) or polarization maintaining (PM) fibers in single fiber and ribbon constructions. To help use the glass solder preforms, OZ Optics can supply a basic resistive or inductive soldering station to solder preforms onto metal ferrules and fibers.
Compatible with Single Mode (SM), Multi Mode (MM) or Polarization Maintaining (PM) Fibers
Alternative to Costly Gold Plating Methods for Hermetic Sealing
Available in Circular or Oval Configurations
Fatigue and Corrosion Resistant
No Flux Required for Use
Low Melting Temperature
High Fluidity When Molten
Large Volume Manufacturing Capacity
Designed to Meet Telcordia Specifications
Applications: Fiber to Metal Hermetic Sealing; Laser Diode Packaging; Integrated Optics Packaging; Vacuum Feed-through Assemblies