Friction Stir Welded Cold Plates for Power Semiconductors

AMS item number: SW10269

0.003 K/W to 0.055 K/W; 4 l/min to 80 l/min; Power Semiconductors; square Our high... more

Product information "Friction Stir Welded Cold Plates for Power Semiconductors"

0.003 K/W to 0.055 K/W; 4 l/min to 80 l/min; Power Semiconductors; square

Our high performance cold plates made from friction stir welded aluminium are the ideal solution for cooling demanding power semiconductors and modules. Within our range, a variety of models are available from a 1.4 kg cold plate dedicated to one press pack disk semiconductor all the way to a large and powerful 22.6 kg version capable of dissipating the heat of six 140 mm x 190 mm IGBT modules. In addition to various standard configurations, our thermal management experts are happy to customize solutions regarding thermodynamics and fluid dynamics as well as the configuration of power modules.

The use of friction stir welding technology (FSW) makes the production of our cold plates both safe and economical. Friction stir welding technology permits particularly homogeneous joints without additional welding material. Due to this homogeneity of the material, FSW joints are particularly corrosion-resistant and can withstand high loads.

With their high heat dissipation capacity, the cold plates are suitable for the following applications, among others:

62 mm Power Semiconductor Modules
150 x 166 mm Cold Plates
140 x 190 mm Power Semiconductor Modules
PrimePACK 3 Power Semiconductor Modules
EconoPack Power Semiconductor Modules
Press-Pack Discs

Aluminium water cold plates for IGBT modules are available in standard configurations, suitable for 130x140, 140x190, Semikron SKiiP3 and 4, SKiM63 and 93, Semipack2, Infineon PrimePACK2 and PrimePACK3, EconoDual3, Fuji Electric High Power 6-Pack, Mitsubishi/Powerex Mega Power Dual IGBT and others.

When cooling press pack power semiconductor discs, even and uniform pressure distribution is very important. Our FSW cold plates, specially designed for cooling press packs, are suitable for 4", 5" and 6" discs, offering a solid construction, perfectly flat surfaces for an optimal contact to the power semiconductor as well as very good thermal performance. For optimum handling, we offer different options for centering the Press Pack discs as well as tools for replacement.

Product Group:

Friction Stir Welded Cold Plates

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