FOCUSSHIFTER Prefocusing Deflection Units

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FOCUSSHIFTER Prefocusing Deflection Units Raylase

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AMS item number: SW11867

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Optical Deflection ±0.393 rad; Processing Speed 30-200 rad/s; Positioning Speed 30-200 rad/s;... more

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Product information "FOCUSSHIFTER Prefocusing Deflection Units"

Optical Deflection ±0.393 rad; Processing Speed 30-200 rad/s; Positioning Speed 30-200 rad/s; Input Aperture 5, 10, 15 mm; Digital Control via SL2-100, RL3-100, or XY2-100 Protocol

Raylase’s FOCUSSHIFTER series of prefocusing deflection units provides tiny spot diameters with flexible focusing range in Z-direction. The modular, compact, robust, and pre-aligned design (CE) makes integration easy. Deflection units for Nd:YAG and CO₂ lasers are designed for field sizes from 100 mm x 100 mm to 300 mm x 300 mm. The field sizes are determined by the f-theta objective type. Submodule for other wavelengths are available upon request.

The FOCUSSHIFTER DIGITAL II deflection units provide flexible software-controlled focusing in the Z-direction, high deflection speed, long-term stability and exceptionally low drift values at 20 bit position resolution. Heat development is minimized as a result of the PWM output stages used.

The third dimension (3D) is not always the nonplus ultra. The FOCUSSHIFTER-14 deflection units deliberately take a (half) step backwards to significantly increase the range of applications for you as a machine builder or integrator in the fields of e-mobility, solar/photovoltaics, and electronics/IT. The FOCUSSHIFTER-14 cleans component contact surfaces (paint, oxide layers, oil, insulation), cuts flexible PCBs, glass displays or polarization foils, texturizes or structures a wide variety of surfaces and connect components, resistance-trims 5G antennas – all this in two and a half dimensions (2.5D) with automatically shifting the focus – generated by the f-theta lens – either downwards or upwards, allowing you to process different height levels of the same workpiece.

The deflection units are compatible with XY2-100 (16 Bit), SL2-100 (20 Bit) or RL3-100 (20 Bit). The units can be controlled digitally using a control card, such as SP-ICE-3 or SP-ICE-1 PCIe PRO, or via an analog current or voltage interface (FOCUSSHIFTER).

Lenses, protective glass, mirror substrates, coatings, and objectives with optimized mounts are available for all typical laser types, wavelengths, light densities, focal lengths and processing areas. This makes it possible to process a wide range of tasks to the highest quality standards and with optimized throughput. Using telecentric F-Theta lenses enables an almost vertical processing beam over the entire field. Customer specific configurations are also possible – we are happy to provide a customized configuration for your application, get in touch with AMS Technologies to discuss your project’s requirements.

Key Features:

Variable, Easy-to adjust Focus Range in Z-Direction
Modular and Compact Design for Easy Integration
Excellent Price-performance Ratio
Reduced Power Loss and Heat Development Due to Digital PWM Output Stages (FOCUSSHIFTER DIGITAL II)
Control: Via SL2-100 Protocol 20 Bit, RL3-100 Protocol 20 Bit, or XY2-100 Protocol 16 Bit
Available Input Apertures: 5, 10, 15 mm
Optical Deflection (typ.): ±0.393 rad
Resolution XY2-100, 16 Bit: 12 µrad
Resolution SL2/RL3-100, 20 Bit: 0.76 µrad
Repeatability (RMS): <0.4, <2.0 µrad
Position Noise (RMS): <2.0, <4.5 µrad
Max. Temperature Drift: 8, 15 ppm/K Gain, 10, 15 µrad/K Offset
Long-term Drift (8 h): <50 to <150 µrad, <30 to <100 µrad (Water Temperature Control)
Beam Displacement: 12.5 to 26.28 mm
Tuning: LN, RA, C, VC, H, M, MA, W
Processing Speed: 30 to 200 rad/s
Positioning Speed: 30 to 200 rad/s
Tracking Error: 0.10 to 0.9 ms
Step Response Time (@1% of Full Scale): 0.33 to 0.69 ms
Power Supply: ±15 to ±18 VDC, 7.5 A RMS, max. 10 A, +30/+48 VDC, 4 A RMS, max. 8 A
Temperature Range: +15°C to +35°C
Protection: IP 54, IP64
Dimensions: 202 x 159 x 150 mm, 330 x 105 x 134 mm
Weight: Approx. 5.3 to 7.5 kg

Applications: Deep Cutting; Deep Engraving; Deep Processing of Materials; In-glass Marking; Creation of 3D Images in Glass Blocks; Marking and Structuring at Various Heights; Cleaning Component Contact Surfaces of Paint, Oxide layers, Oil or Insulation; Cutting Flexible PCBs, Glass Displays or Polarization Foils; Texturizing or Structuring a Wide Variety of Surfaces and Connect Components; Resistance Trimming of 5G Antennas